Test sieve: About soldering inside

2024/11/25 Product Info
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Thank you for your continued patronage of Tokyo Screen's test sieves.

 

We have increased the price of test sieves since October.

As a result, internal soldering processes added to test sieves are also subject to price increases.

(Internal soldering is a process in which the gap between the sieve frame and the mesh is filled with solder.

This has the effect of making it difficult for the sample to get into the gaps.

Depending on the application, it is possible to solder not only the inside but also the outside of the sieve frame.

Please contact us for details.)

 

If you would like to know the new prices, please contact us by phone or email.